schottky barrier diode lrb751s - 40t1g maximum ratings (t a = 25 c) parameter symbol limits unit peak reverse voltage v rm 40 v dc reverse voltage v r 30 v mean rectifying current i o 30 ma peak forward surge current i fsm 200 ma junction temperature t j 125 c storage temperature t stg -40~+125 c electrical characteristics( t a = 25 c ) parameter symbol min. ty p max. unit conditions forward voltage v f -- 0.37 v i f =1ma reverse current i r -- 0.5 av r =30v capacitance between terminals c t - 2.0 - pf v r =1v,f=1mhz device marking lrb751s - 40t1g= 5 features (1)small surface mounting type sc-79/sod523 (2)low reverse current and low forward voltage. (3)high reliability construction silicon epitaxial planar 1 cathode 2 anode leshan radio company, ltd. ordering information device marking shipping LRB751S-40T1G 5 3000/tape&reel lrb751s-40t3g 5 10000/tape&reel we declare that the material of product compliance with rohs requirements. sod - 523 2 1 rev.o 1/3
0 5 10 15 20 25 30 35 100n 10n 1n ta = 125 o c ta = 75 o c ta = 25 o c ta = -25 o c pulse measurement typ. 100 10 1 reverse voltage : v r (v) reverse current : i r (a) fig. 2 reverse characteristics 0 2468101214 1 2 5 10 20 50 100 f = 1mhz ta = 25 o c reverse voltage : v r (v) capacitance between terminals : c t (pf) f ig. 3 capacitance between terminals characteristic s lrb751s - 40t1g electrical characteristic curves(t a = 25 c) leshan radio company, ltd. forward current : i f (a) forward voltage : v f (mv) fig. 1 forward characteristics 0.0001 0.001 0.01 0.1 0 500 1000 1500 25 75 100 125 rev.o 2/3
lrb751s - 40t1g sc - 79/sod - 523 leshan radio company, ltd. notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e do not include mold flash, pro- trusions, or gate burrs. dim min nom max millimeters d 1.10 1.20 1.30 e 0.70 0.80 0.90 a 0.50 0.60 0.70 b 0.25 0.30 0.35 c 0.07 0.14 0.20 l 0.30 ref h 1.50 1.60 1.70 e l2 0.15 0.20 0.25 e d ? x ? ? y ? b 2x m 0.08 x y a h c 12 e top view side view soldering footprint* recommended 2x 0.48 0.40 2x 1.80 dimension: millimeters package outline rev.o 3/3
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